DigiPlus stock

iPhone 8 disclosure: disassembly of internal structure iPhone 8 as a new product launched by Apple in 2017,DigiPlus stock has attracted much attention.It adopts a glass back cover to support new functions such as wireless charging. At the same time, the internal hardware components have also been upgraded and optimized. Today, we will reveal the internal structure of iPhone 8 by disassembling it. First of all, we need to use professional tools to open the iPhone 8. During the disassembly process, we need to pay special attention to protecting the screen to avoid accidental damage. Once the screen is damaged, the device will be unusable, and the repair cost will be very high. After opening the iPhone 8, the first thing that caught my eye was the cricket-shaped battery. Compared with the previous iPhone 7, the battery capacity has been upgraded to 1960mA/h. In addition, in order to ensure security, Apple has also added more control chips to the battery of the iPhone 8 to avoid overcharging or undercharging.Next, we can see that the iPhone 8 uses the A11 Bionic chip, which is Apple's latest processor. This processor uses more than one billion transistors, 1.7 billion more than the A10 chip of the iPhone 7. Therefore, the performance of the A11 Bionic chip is much higher than that of the previous version, with higher computing processing power and higher energy efficiency. In addition, two 4G modules are placed between the battery and the A11 Bionic chip. This is because the iPhone 8 supports the use of multiple SIM cards, so two modules are needed to switch the card slot to provide more flexible communication functions. Below the motherboard, we can see the on-board memory chip and NFC antenna. The on-board memory chip is a key component of iPhone 8 to store data, supporting 64G and 256G capacities.The NFC antenna is the core component that supports payment functions such as Apple Pay. In addition, there are many small connectors on the motherboard of the iPhone 8, including various sensors, camera modules, charging interfaces and other hardware components. These chips and modules are connected to the motherboard through slender wires, making full use of the space. Finally, let's take a look at the parts of the glass back cover. While ensuring the beauty, the glass back cover also needs to support wireless charging function. Therefore, a coil dedicated to wireless charging needs to be placed inside the glass back cover. In general, the design of iPhone 8 is more complex and has more hardware parts. It has been further upgraded on the basis of the previous version, improving the performance, stability and security of the device. Although Apple does not encourage the use ofHouseholds disassemble, but for device enthusiasts, it is still very interesting to gain an in-depth understanding of the structure of iPhone 8.

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